The ruggedized moulded package is made from the same thermoplastic that is an industry standard for integrated circuits.

ECX-3S

ECX-306

ECX-306I

ECX-306X

ECX-31B

ECX-32

ECX-33Q

ECX-33QZ

ECX-34G

ECX-34Q

ECX-34R

ECX-34RR

ECX-34S

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts