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3216TD - Time-delay Chip surface mount fuse

Key Features

  • Time-delay, surface mount fuse.
  • RoHS compliant, lead-free and halogen-free.
  • High inrush withstand capability.
  • Wire-in-Air performance.
  • Compatible with leaded and lead-free reflow and wave solder Agency information.
  • cURus Recognition File number: E19180 Environmental data.
  • Operating temperature range: -55 °C to +125 °C with proper derating.
  • Vibration: MIL-STD-202, Method 204 Condition D.
  • Solderability: ANSI/J-STD-0.

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Datasheet Details

Part number 3216TD
Manufacturer EATON
File Size 454.39 KB
Description Time-delay Chip surface mount fuse
Datasheet download datasheet 3216TD Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Technical Data 4321 Effective May 2017 Supersedes March 2010 3216TD Time-delay Chip™ surface mount fuse HALOGEN HF FREE Pb Product features • Time-delay, surface mount fuse • RoHS compliant, lead-free and halogen-free • High inrush withstand capability • Wire-in-Air performance • Compatible with leaded and lead-free reflow and wave solder Agency information • cURus Recognition File number: E19180 Environmental data • Operating temperature range: -55 °C to +125 °C with proper derating • Vibration: MIL-STD-202, Method 204 Condition D • Solderability: ANSI/J-STD-002C, Test B Soldering method • Wave immersion: 260°C, 10 Sec. max. • Infrared reflow: 260°C, 30 Sec. max. • Hand solder: 350°C, 3 Sec. max. Ordering • Specify packaging and product code (i.e.