0603FA - Fast-acting Chip surface mount fuse

EATON

Key Features

AEC-Q200 qualified.
Fast-acting surface-mount fuse.
Satisfies the EIA/IS-722 standard.
Solder immersion compatible Agency information.
UL Recognition Guide & File numbers: JDYX2 &E19180.
CSA Component Acceptance: 053787 C 000 & Class Number: 1422 30 Soldering method.
Wave immersion: +260 °C, 10 seconds maximum.
Infrared reflow: +260 °C, 30 seconds maximum Environmental data.
Operating temperature: -55 ºC to +125 º.

0603FA fast-acting chip surface mount fuse by EATON - Datasheet Preview

Datasheet Details

Part number	0603FA
Manufacturer	EATON
File Size	569.29 KB
Description	Fast-acting Chip surface mount fuse
Datasheet	0603FA Datasheet

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Full PDF Text Transcription (Reference)

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Technical Data 4336 Effective January 2019 Supersedes May 2017 0603FA Fast-acting Chip™ surface mount fuse HALOGEN HF FREE Pb Surface Mount Device Product features • AEC-Q200 qualified • Fast-acting surface-mount fuse • Satisfies the EIA/IS-722 standard • Solder immersion compatible Agency information • UL Recognition Guide & File numbers: JDYX2 &E19180 • CSA Component Acceptance: 053787 C 000 & Class Number: 1422 30 Soldering method • Wave immersion: +260 °C, 10 seconds maximum • Infrared reflow: +260 °C, 30 seconds maximum Environmental data • Operating temperature: -55 ºC to +125 ºC with proper derating • Load humidity test: MIL-STD-202, Method 103B • Moisture resistance test: MIL-STD-202, Method 106E • Thermal shock test: MIL-STD-202, Method 107D • High frequency vibration test: