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DIM400PBM17-A000 - IGBT

Features

  • 10µs Short Circuit Withstand.
  • High Thermal Cycling Capability.
  • Non Punch Through Silicon.
  • Isolated AlSiC Base with AlN Substrates.
  • Lead Free construction KEY.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Replaces DS5524-2.3 DIM400PBM17-A000 IGBT Bi-Directional Switch Module DS5524-3 November 2010 (LN27710) FEATURES  10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon  Isolated AlSiC Base with AlN Substrates  Lead Free construction KEY PARAMETERS VDRM VT* IC IC(PK) (typ) (max) (max) ±1700V 4.9V 400A 800A * Measured at the power busbars, not the auxiliary terminals APPLICATIONS  Matrix Converters  Brushless Motor Controllers  Frequency Converters The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A.
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