DT8C06 Datasheet | Diotec Semiconductor

FEATURES MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE d H b F8G CED 687 9¡@ SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 MILLIMETERS MIN 2.5 0.6 7.3 9.8 0.9 29.7 3.6 4.4 19.7 13.2 3.8 10.8 3.1 MAX 2.9 0.8 7.7 10.2 1.1 30.3 4.0 4.8 20.3 13.8 4.2 11.2 3.3 YE` V W X c PRQTS¡U SURGE OVERLOAD RATING TO 400 AMPS PEAK THRU-HOLE FOR EASY HEAT SINK MOUNTING UL RECOGNIZED - FILE #E124962 Ro HS PLIANT A5B a INCHES MIN 0.098 0.024 0.287 0.386 0.035 1.17 0.142 0.173 0.776 0.520 0.126 0.425 0.122 MAX 0.114 0.031 0.303 0.402 0.043 1.19 0.157 0.189 0.799 0.543 0.165 0.441 0.130 MECHANICAL DATA e8fhgiqp ‚h- q- …†…x‡©ˆ!- !‰- - l‹‡Œ5lŽt- !xlt‘t’ - ’ “ - l”¡h“’ •!–t—h˜- ™£š ›- œ r itsvuxw yf€ gqp- ‚Ew € - itsq…t€ fh†‡iˆx…tw y- g ‚©‰q€ ˆisw y!‘Rp’tits R“•” –!— ‚ r R˜d™- e- f ’£‰q€ fsw † gqp“hfsi-...