Datasheet Summary
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Data Sheet No. BDTC-800-1A
8 AMP SILICON BRIDGE RECTIFIERS
Features
MECHANICAL SPECIFICATION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE d H b F8G CED 687 9¡@
SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 MILLIMETERS MIN 2.5 0.6 7.3 9.8 0.9 29.7 3.6 4.4 19.7 13.2 3.8 10.8 3.1 MAX 2.9 0.8 7.7 10.2 1.1 30.3 4.0 4.8 20.3 13.8 4.2...