2
Mechanical Data
Surface Mount Package
Case Material: Molded Plastic, UL Flammability Rating 94V-0
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208 e3
Weight: 0.1286 grams (Approximate)
Max Soldering Temperature +260°C for 30 secs as per JEDEC
J-STD-020
Package View
Package Outline Dimensions
QSOP-20
PACKAGE INFORMATION
Top View
ZD
E1/2
E1
D
QSOP-20
E/2
E
h
SEE DETAIL 'A'
PIN 1
A A2
A1
e
b
h
c
1(4x)
1 (4x)
2
R1
R
GAUGE PLANE
SEATING PLANE
L
L2
L1
QSOP-20
Dim Min Max Typ
A 1.55 1.73 -
A1 0.10 0.25 -
A2 1.40 1.50 -
b 0.20 0.30 -
c 0.18 0.25 -
D 8.56 8.74 -
E 5.79 6.20 -
E1 3.81 3.99 -
e 0.635 BSC
h 0.254 0.508 -
L 0.41 1.27 -
L1 1.03 REF
L2 0.254 BSC
R 0.0762 -
-
R1 0.0762 -
-
ZD 1.47 REF
θ 0° 8° -
θ1 5° 15° -
θ2 0° - -
All Dimensions in mm
Suggested Pad Layout
QSOP-20
X1
Y
Y1
C
Dimensions
C
X
X1
Y
Y1
Value
(in mm)
0.635
0.350
6.065
1.450
6.400
Note:
Note:
1
X
The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for
wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,
Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance
distances between device Terminals and PCB tracking.
QSOP-20 Package Information
Rev. 2017-04-04
1 of 5
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April 2017
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