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Diodes Semiconductor Electronic Components Datasheet

QSOP-20 Datasheet

PACKAGE

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2
Mechanical Data
Surface Mount Package
Case Material: Molded Plastic, UL Flammability Rating 94V-0
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208 e3
Weight: 0.1286 grams (Approximate)
Max Soldering Temperature +260°C for 30 secs as per JEDEC
J-STD-020
Package View
Package Outline Dimensions
QSOP-20
PACKAGE INFORMATION
Top View
ZD
E1/2
E1
D
QSOP-20
E/2
E
h
SEE DETAIL 'A'
PIN 1
A A2
A1
e
b
h
c
1(4x)
1 (4x)
2
R1
R
GAUGE PLANE
SEATING PLANE
L
L2
L1
QSOP-20
Dim Min Max Typ
A 1.55 1.73 -
A1 0.10 0.25 -
A2 1.40 1.50 -
b 0.20 0.30 -
c 0.18 0.25 -
D 8.56 8.74 -
E 5.79 6.20 -
E1 3.81 3.99 -
e 0.635 BSC
h 0.254 0.508 -
L 0.41 1.27 -
L1 1.03 REF
L2 0.254 BSC
R 0.0762 -
-
R1 0.0762 -
-
ZD 1.47 REF
θ 0° 8° -
θ1 5° 15° -
θ2 0° - -
All Dimensions in mm
Suggested Pad Layout
QSOP-20
X1
Y
Y1
C
Dimensions
C
X
X1
Y
Y1
Value
(in mm)
0.635
0.350
6.065
1.450
6.400
Note:
Note:
1
X
The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for
wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,
Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance
distances between device Terminals and PCB tracking.
QSOP-20 Package Information
Rev. 2017-04-04
1 of 5
www.diodes.com
April 2017
© Diodes Incorporated


Diodes Semiconductor Electronic Components Datasheet

QSOP-20 Datasheet

PACKAGE

No Preview Available !

2 QSOP-20
Minimum Packing Quantity
Quantity
Tape Width
Part Number Suffix
13” Reel
2,500
16mm
TC
Note:
Note:
Note:
Package quantities given are for minimum packaging quantity only, not minimum order quantity. For minimum order quantity, please contact Sales
Department.
No mixed date codes or partial quantity (less than minimum packaging quantity) per packaging is allowed.
In no case shall there be two or more consecutive components missing from any reel for any reason.
Device Tape Orientation
Tape Width
Part Number Suffix
Tape Orientation
Pin 1
16mm
TC
Direction of feed
Note: For part marking, refer to product datasheet.
Note: Tape and package drawings are not to scale and are shown for device tape orientation only.
Embossed Carrier Tape Specifications
Tape Width (W)
12mm
Dimension
B1
D
D1
E
A0 B0 K0
Value (mm)
Dimension
Value (mm)
Dimension
Value (mm)
12.1 max.
F
7.5±0.10 P2 2.0±0.10
1.5+0.10 -0.0
K
3.7 max.
t 0.40 max.
1.4 min.
P 8.0±0.10 W
16±0.30
1.75±0.10
P0
4.0±0.10
Determined by component size. The clearance between the component and the cavity must comply
to the rotational and lateral movement requirement provided in figures in the "Maximum Component
Movement in Tape Pocket” section.
QSOP-20 Package Information
Rev. 2017-04-04
2 of 5
www.diodes.com
April 2017
© Diodes Incorporated


Part Number QSOP-20
Description PACKAGE
Maker Diodes
PDF Download

QSOP-20 Datasheet PDF






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