P4SMAJ6.5ADF
Key Features
- Packaged in the Low Profile D-FLAT to Optimize Board Space
- Glass Passivated Die Construction
- Excellent Clamping Capability
- IEC 61000-4-2 (ESD): Air ±30kV, Contact ±30kV
- Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
- Halogen and Antimony Free. “Green” Device (Note 3) Mechanical Data
- Case: D-FLAT
- Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0
- Moisture Sensitivity: Level 1 per J-STD-020
- Terminals: Finish - Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208
