* Planar Die Construction
* 500mW Power Dissipation
* General Purpose, Medium Current
* Ideally Suited for Automated Assembly Processes
* Totally Lead.

BZT52C8V2-F

BZT52C8V2-G

BZT52C8V2-V

BZT52C8V2CR-C

BZT52C8V2K

BZT52C8V2LP

BZT52C8V2S

BZT52C8V2S-FL

BZT52C10

BZT52C10-F

BZT52C10-G

BZT52C10-V

BZT52C10CR-C

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