* Planar Die Construction
* 500mW Power Dissipation
* General Purpose, Medium Current
* Ideally Suited for Automated Assembly Processes
* Totally Lead.

BZT52C3V0-F

BZT52C3V0-G

BZT52C3V0-V

BZT52C3V0CR-C

BZT52C3V0K

BZT52C3V0LP

BZT52C3V0S

BZT52C3V0S-FL

BZT52C3V3

BZT52C3V3-F

BZT52C3V3-G

BZT52C3V3-V

BZT52C3V3CR-C

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