VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM .

SB410

SB40-03T

SB40-05

SB40-05H

SB40-05J

SB400

SB400L

SB401

SB40100CT

SB40100DC

SB40100FCT

SB401010

SB401010K

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts