VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM .

SB406

SB4060CT

SB4060DC

SB4060FCT

SB4060PT

SB40-03T

SB40-05

SB40-05H

SB40-05J

SB400

SB400L

SB401

SB40100CT

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