VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM .

SB400

SB40-03T

SB40-05

SB40-05H

SB40-05J

SB401

SB40100CT

SB40100DC

SB40100FCT

SB401010

SB401010K

SB401L

SB402

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