RGP306 Datasheet | Diotec Semiconductor

FEATURES MECHANICAL SPECIFICATION PROPRIETARY SOFT GLASS R JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE ACTUAL SIZE OF DO-27 PACKAGE - 27 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) SERIES RGP300 - RGP310 BD (Dia) EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 3A at T­ = 55 ® C WITH NO THERMAL RUNAWAY MECHANICAL DATA “a¨¨©o”ª •«– ¬ —}£˜)”™1 ­š€ ™"”)“›®)šf¯ £ ¯œ- ° -  ž¤±1Ÿ$” ¢°¯ ²¡"³£ ¤¦´–µi¤¶ –¦ - i- ¸ ¡¦i- ¹ –)ºe ­¯ ²¤”¦£ •"—i»1£ ”° –¤¤”¦)¯ ”¦£i£ –¤”¤¤• ¼1¡"£ ¤¦–¦º¯ ²³1—i»)–)ºo½`¾ «  ¼ ¹ š¿ži-...