VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM .

ASB404L

ASB406L

ASB00340

ASB0130

ASB01503HA3-00CYN

ASB01703HA3-00CAH

ASB0230

ASB0240

ASB0305HP-00CP4

ASB0320

ASB0330

ASB0340

ASB0412LA-A

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