* International standard package * Direct copper bonded Al2O3-ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ * UL registered, E 72873 APPLICATI.

www.DataSheet.net/ ADVANTAGES * Space and weight savings * Simple mounting * Improved temperature and power cycling * .

CDD120N12

CDD120N14

CDD120N16

CDD120N18

CDD120

CDD10810

CDD11210

CDD11610

CDD2395

CDDFN10-0516P

CDDFN10-2574N

CDDFN10-3304NA

CDDFN2-T12C

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts