File Size : 455.62KB ·
2 hits
· Low profile space
· Ideal for automated placement
· Glass passivated chip junctions
· Low forward voltage drop
· Low leakage current
· High forward surge capability
· High temperature soldering :
260℃ / 10 seconds at terminals
· Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechani.
