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S72XS-R - Flash and DDR DRAM

General Description

This datasheet contains information on the S72XS-R Multi-Chip Product (MCP) stacked products.

Refer to the S29VS256R, S29VS128R, S29XS256R, S29XS128R datasheet (002-00833) for full electrical specifications of the Flash memory component.

Key Features

  • Power supply voltage.
  • 1.7V to 1.95V.
  • Burst speed.
  • Flash = 83 MHz, 104 MHz or 108 MHz.
  • DDR DRAM = 166 MHz.
  • Packages.
  • 8.0  8.0 mm, 133-ball MCP.
  • Temperature range.
  • Wireless:.
  • 25 °C to +85 °C.
  • Industrial:.
  • 40 °C to +85 °C Table 1. Memory Density Flash Density 256 Mb General.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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S72XS-R MCP 256 Mb (16M x 16 bit), 1.8V MirrorBit® Flash and DDR DRAM Features ■ Power supply voltage ❐ 1.7V to 1.95V ■ Burst speed ❐ Flash = 83 MHz, 104 MHz or 108 MHz ❐ DDR DRAM = 166 MHz ■ Packages ❐ 8.0  8.0 mm, 133-ball MCP ■ Temperature range ❐ Wireless: –25 °C to +85 °C ❐ Industrial: –40 °C to +85 °C Table 1. Memory Density Flash Density 256 Mb General Description This datasheet contains information on the S72XS-R Multi-Chip Product (MCP) stacked products. Refer to the S29VS256R, S29VS128R, S29XS256R, S29XS128R datasheet (002-00833) for full electrical specifications of the Flash memory component.