2M x 36/4M x 18 Pipelined DCD SRAM
• Fast clock speed: 250, 200, and 167 MHz
• Provide high-performance 3-1-1-1 access rate
• Fast access time: 2.6, 3.0, and 3.4 ns
• Optimal for depth expansion
• Single 3.3V –5% and +5% power supply VDD
• Separate VDDQ for 3.3V or 2.5V
• Common data inputs and data outputs
• Byte Write Enable and Global Write control
• Chip enable for address pipeline
• Address, data, and control registers
• Internally self-timed Write Cycle
• Burst control pins (interleaved or linear burst
• Automatic power-down for portable applications
• High-density, high-speed packages
• JTAG boundary scan for BGA packaging version
• Available in 119-ball bump BGA and 100-pin TQFP
packages (CY7C1484V33 and CY7C1485V33).
• 165-ball FBGA will be offered on an opportunity basis.
(Please contact Cypress sales or marketing)
The Cypress Synchronous Burst SRAM family employs
high-speed, low-power CMOS designs using advanced
single-layer polysilicon, triple-layer metal technology. Each
memory cell consists of six transistors.
The CY7C1484V33 and CY7C1485V33 SRAMs integrate
2,097,152 × 36/4,194,304 × 18 SRAM cells with advanced
synchronous peripheral circuitry and a two-bit counter for
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Shaded areas contain advance information.
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered Clock Input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining Chip Enable (CE), burst control
inputs (ADSC, ADSP, and ADV), write enables (BWa, BWb,
BWc, BWd, and BWE), and Global Write (GW).
Asynchronous inputs include the Output Enable (OE) and
burst mode control (MODE). The data (DQx) and the data
parity (DPx) outputs, enabled by OE, are also asynchronous.
DQa,b,c,d and DPa,b,c,d apply to CY7C1484V33 and DQa,b
and DPa,b apply to CY7C1485V33. a, b, c, and d each are
eight bits wide in the case of DQ and one bit wide in the case
Addresses and chip enables are registered with either
Address Status Processor (ADSP) or Address Status
Controller (ADSC) input pins. Subsequent burst addresses
can be internally generated as controlled by the Burst Advance
Address, data inputs, and write controls are registered on-chip
to initiate self-timed Write cycle. Write cycles can be one to
four bytes wide as controlled by the write control inputs.
Individual byte write allows individual byte to be written. BWa
controls DQa and DPa. BWb controls DQb and DPb. BWc
controls DQc and DPd. BWd controls DQ and DPd. BWa, BWb,
BWc, BWd can be active only with BWE being LOW. GW being
LOW causes all bytes to be written. Write pass-through
capability allows written data available at the output for the
immediately next Read cycle. This device also incorporates
pipelined enable circuit for easy depth expansion without
penalizing system performance.
The CY7C1484V33/CY7C1485V33 are both double-cycle
deselect parts.All inputs and outputs of the CY7C1484V33,
CY7C1485V33 are JEDEC standard JESD8-5-compatible.
Cypress Semiconductor Corporation • 3901 North First Street • San Jose, CA 95134 • 408-943-2600
Document #: 38-05285 Rev. *A
Revised January 18, 2003