CY5057 die equivalent, high-frequency flash programmable pll die.
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Benefits
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Flash programmable die for in-package programming of crystal oscillators High resolution phase-locked loo.
through selectable instantaneous or synchronous change in outputs. Suitable for most PC, consumer, and networking applic.
Note Active die size: X = 75.0 mils / 1907 μm Y = 56.2 mils / 1428 μm Scribe: Y (horizontal) = 2.8 mils / 71 μm X (vertical) = 3.4 mils / 86.2 μm Bond pad opening: 85 μm x 85 μm Pad pitch: 125 μm x 125 μm (pad center to pad center) Wafer thickness: .
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