CGH55030P1
Features
- 300 MHz Instantaneous Bandwidth
- 30 W Peak Power Capability
- 10 d B Small Signal Gain
- 4 W PAVE < 2.0 % EVM
- 25 % Efficiency at 4 W Average Power
- Designed for Wi MAX Fixed Access 802.16-2004 OFDM Applications
- Designed for Multi-carrier DOCSIS Applications
Rev 4.0
- May 2015
Subject to change without notice. .cree./rf
Absolute Maximum Ratings (not simultaneous) at 25˚C Case Temperature
Parameter
Symbol
Rating
Drain-Source Voltage Gate-to-Source Voltage Power Dissipation Storage Temperature Operating Junction Temperature
VDSS VGS PDISS TSTG TJ
84 -10, +2
14 -65, +150
Maximum Forward Gate Current Maximum Drain Current1 Soldering Temperature2 Screw Torque
IGMAX IDMAX TS
τ
7.0 3 245 60
Thermal Resistance, Junction to Case3
RθJC
Case Operating Temperature3
TC -40, +150
Note: 1 Current limit for long term, reliable operation. 2 Refer to the Application Note on soldering at .cree./RF/Document-Library
3 Measured for the CGH55030F1 at PDISS =...
