-Planar die construction. -200mW power dissipation. -Ideally suited for automated assembly process. -Ultra small surface mount package. Mechanical data -Case: SOT-323, Mo.

CZRV3-55C3V3

CZRV3-55C3V6

CZRV3-55C3V9

CZRV3-55C30

CZRV3-55C33

CZRV3-55C36

CZRV3-55C39

CZRV3-55C10

CZRV3-55C11

CZRV3-55C12

CZRV3-55C13

CZRV3-55C15

CZRV3-55C16

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts