-Planar die construction. -200mW power dissipation. -Ideally suited for automated assembly process. -Ultra small surface mount package. Mechanical data -Case: SOT-323, Mo.

CZRV3-55C2V4

CZRV3-55C2V7

CZRV3-55C20

CZRV3-55C22

CZRV3-55C24

CZRV3-55C27

CZRV3-55C10

CZRV3-55C11

CZRV3-55C12

CZRV3-55C13

CZRV3-55C15

CZRV3-55C16

CZRV3-55C18

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