CZRM27C100P Datasheet | Comchip Technology

Features ‘ Low profile surface-mount package ‘ Zener and surge current specification ‘ Low leakage current ‘ Excellent stability Power Dissipation 0.8Watts MINI-SMA 0.161(4.1) 0.146(3.7) 0.012(0.3)Typ. 0.071(1.8) 0.055(1.4) Mechanical Data ‘ Case: Molded plastic MINI-SMA ‘ ‘ ‘ ‘ ‘ Epoxy: UL 94V-0 rate flame retardant Solderable per MIL-STD-202, method 208 guaranteed Polarity: cathode band Mounting position: Any Weight: 0.04gram(approx.) 0.035(0.9)Typ. 0.110(2.8) 0.094(2.4) 0.063(1.6) 0.055(1.4) 0.035(0.9)Typ. Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25o C ambient temperature unless otherwise specified. Parameter VALUE Units Forward voltage IF=0.2A Power Dissipation TA=25 C ( Note ) o TL=80 C o 0.8 2.3 Non-repetitive peak pulse TJ=25 C power dissipation 100us square pulse Non-repetitive peak pulse TJ=25 C power dissipation 10/1000us waveform (CZRM27C7V5P to C100P) Non-repetitive peak pulse TJ=25 C power dissipation 10/1000us waveform (CZRM27C110P to C200P) o o o Thermal resistance junction to lead ambient ( Note ) Operating junction and Storage Temperature Range NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40um thick) 30 180 150 / -55 to +150 o MDS0310010B Page 1 Surface Mount Zener Diode CHIP .chiptech. CZRM27C6V8P THRU CZRM27C200P Application Case Part No. CZRM27C6V8P CZRM27C7V5P CZRM27C8V2P CZRM27C9V1P CZRM27C10P CZRM27C11P CZRM27C12P CZRM27C13P CZRM27C15P CZRM27C16P CZRM27C18P CZRM27C20P CZRM27C22P Electrical Characteristic (Ta=25o C) Temp. Coefficient Vzmin Vzmax Iz Zzmax Zztyp IR(u A) Max. min max o %/ C %/o C (V) ( V ) (m A) (Ohm) (Ohm) VR(V) 6.4 7.0 7.7 8.5 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28.0 31 34 37 40 44 48 52 58 64 70 77 85 94 104 114 124 138 153 168 188 B:2% 7.2 7.9 8.7 9.6 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32 35 38 41 46 50 54 60 66 72 79 87 96 106 116 127 141 156 171 191 212 A:1%...