-Planar Die Construction -500mW Power Dissipation -Ideally Suited for Automated Assembly Processes DO-35 1.02(26.00) Min. Mechanical data -Case: Molded plastic, DO-35 -.

1N5258B-1

1N5258B

1N5258BUR-1

1N5258

1N5258C

1N5258UR

1N5258UR-1

1N5250

1N5250B

1N5250B-1

1N5250B-G

1N5250BUR-1

1N5250C

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts