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-Planar Die Construction -500mW Power Dissipation -Ideally Suited for Automated Assembly Processes DO-35 1.02(26.00) Min. Mechanical data -Case: Molded plastic, DO-35 -Terminals : Solderable per MIL-STD-750,Method Method 2026 -Polarity: Indicated by cathode band -Marking: Type number -Weight: 0.13.
