CP302-MPSH10 Datasheet, Central Semiconductor

CP302-MPSH10 die equivalent, npn - rf transistor die.

CP302-MPSH10

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CP302-MPSH10 Datasheet

Application

MECHANICAL SPECIFICATIONS: Die Size 14.5 x 14.5 MILS B Die Thickness 9.0 MILS Base Bonding Pad Size 2.3 x 2.3 M.

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TAGS

Central Semiconductor

Manufacturer

Central Semiconductor (https://www.centralsemi.com/)

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