* Wavelengths for Blue, Green and White-conversion
* 50 mm Chip Thickness
* RF Performance:
  – 450 nm
  – 12+ mW
  .

include consumer products, mobile devices and automotive applications where a small, thin form factor is required. FEAT.

P-N Junction Area (μm) Chip Top Area (μm) Chip Bottom Area (μm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Bonding Area Note 5 Diameter (μm) Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT190-Sxxxx-31 Dimension Tolerance 160.

C460UT170

C4600

C4601

C4602

C4606

C461

C4612

C4613

C4615

C4616

C4621

C4623

C4624

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