B1DW-F Overview
Key Features
- Low profile surface mounted application in order to optimize board space
- High current capability, low forward voltage drop
- High surge capability
- Superfast recovery time for switching mode application
- Glass passivated chip junction
- Suffix "G" indicates Halogen free parts, ex. Β1ΑWG-F
- Epoxy:UL94-V0 rated flame retardant
- Case : Molded plastic, SOD-123F
- Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity : Indicated by cathode band
