ABSOLUTE MAXIMUM RATINGS(1)
+IN to GND ................................................................................ VA + 0.1V
–IN to GND ....................................................................................... +0.5V
VA to GND ............................................................................. –0.3V to +7V
Digital Input Voltage to GND ................................... –0.3V to (VA + 0.3V)
VOUT to GND ............................................................ –0.3V to (VA + 0.3V)
Operating Temperature Range ...................................... –40°C to +105°C
Storage Temperature Range ......................................... –65°C to +150°C
Junction Temperature (TJ max) .................................................... +150°C
TQFP Package:
Power Dissipation ................................................... (TJ max – TA) /θJA
θJA Thermal Impedance ......................................................... 240°C/W
Lead Temperature:
Vapor Phase (soldering, 60s) ................................................. +215°C
Infrared (soldering, 15s) .......................................................... +220°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes
could cause the device not to meet its published specifications.
PIN CONFIGURATION
Top View
TQFP
32 31 30 29 28 27 26 25
DB15 1
DB14 2
DB13 3
DB12 4
DB11 5
DB10 6
DB9 7
DB8 8
ADS8322
24 CS
23 BYTE
22 RD
21 CONVST
20 CLOCK
19 DGND
18 +VD
17 BUSY
9 10 11 12 13 14 15 16
PIN ASSIGNMENTS
PIN NAME DESCRIPTION
1
DB15
Data Bit 15 (MSB)
2
DB14
Data Bit 14
3
DB13
Data Bit 13
4
DB12
Data Bit 12
5
DB11
Data Bit 11
6
DB10
Data Bit 10
3
DB9
Data Bit 9
8
DB8
Data Bit 8
9
DB7
Data Bit 7
10 DB6 Data Bit 6
11 DB5 Data Bit 5
12 DB4 Data Bit 4
13 DB3 Data Bit 3
14 DB2 Data Bit 2
15 DB1 Data Bit 1
16 DB0 Data Bit 0 (LSB)
17 BUSY High when a conversion is in progress.
18 +VD Digital Power Supply, +5VDC.
19 DGND Digital Ground
PIN NAME DESCRIPTION
20 CLOCK An external CMOS compatible clock can be applied
to the CLOCK input to synchronize the conversion
process to an external source.
21 CONVST Convert Start
22 RD Synchronization pulse for the parallel output.
23 BYTE Selects 8 most significant bits (LOW) or 8 least
significant bits (HIGH). Data valid on pins 9-16.
24 CS Chip Select
25 –IN Inverting Input Channel
26 +IN Noninverting Input Channel
27
AGND
Analog Ground
28 +VA Analog Power Supply, +5VDC.
29 NC No Connect
30 NC No Connect
31 REFIN Reference Input. When using the internal 2.5V refer-
ence tie this pin directly to REFOUT.
32 REFOUT Reference Output. A 0.1µF capacitor should be con-
nected to this pin when the internal reference is
used.
PACKAGE/ORDERING INFORMATION
PRODUCT
ADS8322Y
"
ADS8322YB
"
MAXIMUM
INTEGRAL
LINEARITY
ERROR (LSB)
±8
"
±6
"
NO
MISSING
CODES
ERROR (LSB)
14
"
15
"
PACKAGE
TQFP-32
"
TQFP-32
"
PACKAGE
DRAWING
NUMBER
351
"
351
"
SPECIFICATION
TEMPERATURE
RANGE
–40°C to 85°C
"
–40°C to 85°C
"
ORDERING
NUMBER(1)
ADS8322Y/250
ADS8322Y/2K
ADS8322YB/250
ADS8322YB/2K
TRANSPORT
MEDIA
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces
of “ADS8322Y/2K” will get a single 2000-piece Tape and Reel.
2 ADS8322
SBAS215
