HSMQ-C230 Datasheet | Broadcom

Description The Broad® HSMQ-C230 is a side-emitting surface-mount chip LED. This chip LED es in small package footprint of 1.0 mm × 0.55 mm. Its small form factor allows flexible board design, and the LED can be closely mounted, thus offering maximum miniaturization benefits to the user. The low package height of 0.3 mm makes it an ideal solution for an application that has limited head room, such as wearables and small portable handheld devices. By using efficient and high brightness In Ga N LED materials, this product is capable of delivering high light output. It is patible with industry-standard automatic machine placement and reflow soldering. Features - LEDs with In Ga N die - Surface-mount device with 0.30-mm height - patible with reflow soldering - Tape in 8-mm carrier tape on a 7-in. diameter reel Applications - Backlighting - Indicator CAUTION! LEDs are class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broad HSMQ-C230-DS101 February 7, 2024 HSMQ-C230 Data Sheet Figure 1: Package Dimensions Green Color Side-Mount Chip LED NOTE: 1. All dimensions are in millimeters. 2. Tolerance ±0.1 mm unless otherwise specified. 3. Encapsulant: clear epoxy Absolute Maximum Value at TJ = 25°C Parameter DC Forward Currenta Peak Forward Currentb Power Dissipation LED Junction Temperature Operating Temperature Storage Temperature a. Derate as shown in Figure 10. b. Duty factor = 10%, frequency = 1 k Hz. Rating 20 100 78 95 - 40 to +85 - 40 to +85 Units m A m A m W °C °C °C Broad HSMQ-C230-DS101 2 HSMQ-C230 Data Sheet Green Color Side-Mount Chip LED Optical/Electrical Characteristics at TJ = 25°C, IF = 20 m A Parameter Min. Typ. Max. Units Luminous Intensity, Iva - -...