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HSMQ-C230 - Green Color Side-Mount ChipLED

General Description

The Broadcom® HSMQ-C230 is a side-emitting surface-mount chipLED.

This chipLED comes in small package footprint of 1.0 mm × 0.55 mm.

Its small form factor allows flexible board design, and the LED can be closely mounted, thus offering maximum miniaturization benefits to the user.

Key Features

  • LEDs with InGaN die.
  • Surface-mount device with 0.30-mm height.
  • Compatible with reflow soldering.
  • Tape in 8-mm carrier tape on a 7-in. diameter reel.

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Datasheet Details

Part number HSMQ-C230
Manufacturer Broadcom
File Size 709.89 KB
Description Green Color Side-Mount ChipLED
Datasheet download datasheet HSMQ-C230 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HSMQ-C230 Green Color Side-Mount ChipLED Data Sheet Description The Broadcom® HSMQ-C230 is a side-emitting surface-mount chipLED. This chipLED comes in small package footprint of 1.0 mm × 0.55 mm. Its small form factor allows flexible board design, and the LED can be closely mounted, thus offering maximum miniaturization benefits to the user. The low package height of 0.3 mm makes it an ideal solution for an application that has limited head room, such as wearables and small portable handheld devices. By using efficient and high brightness InGaN LED materials, this product is capable of delivering high light output. It is compatible with industry-standard automatic machine placement and reflow soldering. Features  LEDs with InGaN die  Surface-mount device with 0.