HSMF-C116 chipled equivalent, ultra small surface mount tricolor chipled.
* LED with AlInGaP and InGaN die
* Surface mount device with ultra small 1.0 × 1.0mm
footprint
* Suitable for application that requires small pitch size
*.
The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PC.
This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrat.
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