n Surface mount packaging for automated assembly n Small footprint size (1210) and low profile for space-constrained mobile applications n Ultra-low resistance .

n Ultra-low resistance n RoHS compliant* and halogen free** n Agency recognition: Applications n Thermal protection.

Resistance............................................................. In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max Time to Trip............................................................ At specified cu.

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