Description
3 Ordering Options 4
Valid Combinations.
Standard 4 Signal Description and Assignment 5 Package Options 6
48-Pin TSOP (Top View) 6 63-Ball FBGA (Balls Down, Top View) 7 Architecture 8 Status Register 11 Bus Interface 17 Standby 17 Busy 17 Device Protection (Write Protect WP#) 17 Command Input 18 Address Input 18 Data Input 19 Data Output 20 Command Set 21 Device Initialization.
Features
- Interface ▪ Open NAND Flash Interface (ONFI 1.0) compliant ▪ x8, x16.
- Technology ▪ Single-level cell (SLC) ▪ 3xnm NAND Process.
- Operating Voltage Range ▪ VCC: 2.70V.
- 3.60V.
- Operating Temperature Range ▪ Industrial: -40°C to 85°C.
- Packages ▪ 48-pin TSOP (12.0mm x 20mm) ▪ 63-ball FBGA (9mm x 11mm).
- Device Signature ▪ Manufacturer’s ID ▪ Device ID ▪ Device Parameters ▪ Unique ID.
- One Time Programmable Area (OTP) ▪ One Block (.
