MBRS250G
Features
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Low power loss, high efficiency.
- High current capability, low forward voltage drop.
- High surge capability.
- Guardring for overvoltage protection.
- Ultra high-speed switching.
- Silicon epitaxial planar chip, metal silicon junction.
- Lead-free parts meet environmental standards of
MIL-STD-19500/228
- Suffix "-H" indicates Halogen-free parts, ex. MBRS220G-H.
Mechanical data
- Epoxy: UL94-V0 rated frame retardant
- Case: Molded plastic, DO-214AC / SMA
- Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
- Polarity: lndicated by cathode band
- Mounting Position: Any
- Weight: Approximated 0.05 gram
Package outline SMA
0.196(4.9) 0.180(4.5)
0.012(0.3) Typ.
0.106(2.7) 0.091(2.3)
0.032(0.8) Typ.
0.068(1.7) 0.060(1.5)
0.032 (0.8) Typ.
Dimensions in inches and...
