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AS4C8M16D1A - 8M x 16 DDR

Description

Table 2.

Differential Clock: CK, CK are driven by the system clock.

are sampled on the positive edge of CK.

Features

  • Fast clock rate: 200MHz.
  • Operating temperature: - Commercial (0~70°C) - Industrial (-40~85°C).
  • Differential Clock CK & CK input.
  • Bi-directional DQS.
  • DLL enable/disable by EMRS.
  • Fully synchronous operation.
  • Internal pipeline architecture.
  • Four internal banks, 2M x 16-bit for each bank.
  • Programmable Mode and Extended Mode registers - CAS Latency: 2, 2.5, 3 - Burst length: 2, 4, 8 - Burst Type: Sequential & Interleave.

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Datasheet Details

Part number AS4C8M16D1A
Manufacturer Alliance Semiconductor
File Size 1.91 MB
Description 8M x 16 DDR
Datasheet download datasheet AS4C8M16D1A Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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8Mx16 DDR1-AS4C8M16D1A Revision History AS4C8M16D1A - 66-pin TSOPII PACKAGE Revision Details Rev 1.1 Preliminary datasheet Date July 2015 Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211 Alliance Memory Inc. reserves the right to change products or specification without notice Confidential - 1/66 - Rev.1.1 July 2015 8Mx16 DDR1-AS4C8M16D1A Features • Fast clock rate: 200MHz • Operating temperature: - Commercial (0~70°C) - Industrial (-40~85°C) • Differential Clock CK & CK input • Bi-directional DQS • DLL enable/disable by EMRS • Fully synchronous operation • Internal pipeline architecture • Four internal banks, 2M x 16-bit for each bank • Programmable Mode and Extended Mode registers - CAS Latency: 2, 2.
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