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AS4C2M32S - 2M x 32 bit Synchronous DRAM

Features

  • Fast access time: 5.4/5.4 ns.
  • Fast Clock rate: 166/143 MHz.
  • Fully synchronous operation.
  • Internal pipelined architecture.
  • Four internal banks (512K x 32bit x 4bank).
  • Programmable Mode - CAS Latency: 2 or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: Sequential or Interleaved - Burst-Read-Single-Write.
  • Burst stop function.
  • Individual byte controlled by DQM0-3.
  • Auto Refresh and Self Refresh.
  • Operating temperature range - Commercial (0 ~.

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Datasheet Details

Part number AS4C2M32S
Manufacturer Alliance Semiconductor
File Size 1.23 MB
Description 2M x 32 bit Synchronous DRAM
Datasheet download datasheet AS4C2M32S Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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AS4C2M32S Confidential 2M x 32 bit Synchronous DRAM (SDRAM) Advanced (Rev. 3.0, Dec. /2012) Features  Fast access time: 5.4/5.4 ns  Fast Clock rate: 166/143 MHz  Fully synchronous operation  Internal pipelined architecture  Four internal banks (512K x 32bit x 4bank)  Programmable Mode - CAS Latency: 2 or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: Sequential or Interleaved - Burst-Read-Single-Write  Burst stop function  Individual byte controlled by DQM0-3  Auto Refresh and Self Refresh  Operating temperature range - Commercial (0 ~ 70°C) - Industrial (-40 ~ 85°C)  4096 refresh cycles/64ms  Single +3.3V ± 0.3V power supply  Interface: LVTTL  90-ball 8 x 13 x 1.
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