* For surface mounted applications
* Low profile package
* Glass Passivated Chip Junction
* Superfast reverse recovery time
* Available in SMAF Packag.

* Low profile package
* Glass Passivated Chip Junction
* Superfast reverse recovery time
* Available in .

The ES1AF~ES1JF is available in SMAF Package FEATURES
* For surface mounted applications
* Low profile package
* Glass Passivated Chip Junction
* Superfast reverse recovery time
* Available in SMAF Package ORDERING INFORMATION .

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