HSMF-C165
HSMF-C165 is Miniature Bi-Color Surface Mount Chip LEDs manufactured by Agilent Technologies.
Description
The HSMF-C16x series of bicolor chip-type LEDs is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 2 dies.
The small size, narrow footprint, and low profile make this series of LEDs excellent for backlighting, status indication, and front panel illumination applications.
Features
- Small 1.6 x 0.8 mm footprint
- Diffused optics
- Operating temperature range of
- 30°C to +85°C
- patible with reflow soldering
- Three color binations available: red/green, yellow/ green, orange/green
- Available in 8 mm tape on 7" (178 mm) diameter reels Applications
- Keypad backlighting
- Symbol backlighting
- LCD backlighting
- Status indication
- Front panel indicator
Device Selection Guide Part Number HSMF-C165 HSMF-C166 HSMF-C167 Color High Efficiency Red/Green Yellow/Green Orange/Green Parts per Reel 4000 4000 4000
Free Datasheet http://.Datasheet-PDF./
Package Dimensions
CATHODE LINE LED DIES
3 0.8 (0.031)
1.6 (0.063)
GREEN 1 RED/YELLOW/ORANGE 2 4 POLARITY 3
DIFFUSED EPOXY
0.5 (0.020) PC BOARD
CATHODE LINE 0.4 (0.016)
0.16 (0.006) 0.4 (0.016)
0.3 (0.012)
SOLDERING TERMINALS
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Free Datasheet http://.Datasheet-PDF./
Absolute Maximum Ratings at TA = 25˚C Parameter DC Forward Current [1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature
Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/10 duty and 0.1 ms width.
HSMF-C165/166/167 20 100 52 5 95
- 30 to +85
- 40 to +85 See reflow soldering profile (Figure...
