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MSW2062-206 - Surface Mount PIN Diode

Download the MSW2062-206 datasheet PDF. This datasheet also covers the MSW2060-206 variant, as both devices belong to the same surface mount pin diode family and are provided as variant models within a single manufacturer datasheet.

General Description

The MSW2060-206, MSW2061-206, and MSW2062-206 Series of Surface Mount Silicon PIN Diode SP2T Switches is manufactured using Aeroflex/Metelics proven hybrid manufacturing process incorporating High Voltage PIN Diodes and passive devices integrated within a ceramic substrate.

Key Features

  • Surface Mount SP2T Switch in Compact Outline: 8mm L x 5mm W x 2.5 mm H.
  • Higher Average Power Handling than Plastic (100 W C. W. ).
  • Higher Voltage > 500 Volts for Higher RF Peak Power (500 W).
  • Lower Insertion Loss ( 0.30 dB ) & Higher IIP3 (65 dBm).
  • Operates From +5V & -180V for High Linearity.
  • RoHS Compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MSW2060-206-Aeroflex.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MSW2062-206
Manufacturer Aeroflex
File Size 404.10 KB
Description Surface Mount PIN Diode
Datasheet download datasheet MSW2062-206 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Surface Mount PIN Diode SP2T Switches MSW2060-206, MSW2061-206 & MSW2062-206 Series Datasheet Features • Surface Mount SP2T Switch in Compact Outline: 8mm L x 5mm W x 2.5 mm H • Higher Average Power Handling than Plastic (100 W C.W.) • Higher Voltage > 500 Volts for Higher RF Peak Power (500 W) • Lower Insertion Loss ( 0.30 dB ) & Higher IIP3 (65 dBm) • Operates From +5V & -180V for High Linearity • RoHS Compliant Description The MSW2060-206, MSW2061-206, and MSW2062-206 Series of Surface Mount Silicon PIN Diode SP2T Switches is manufactured using Aeroflex/Metelics proven hybrid manufacturing process incorporating High Voltage PIN Diodes and passive devices integrated within a ceramic substrate. This low profile, compact, surface mount component, ( 8mm L x 5mm W x 2.