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MMP7076-127-1 - High Power MELF PIN Diodes

Download the MMP7076-127-1 datasheet PDF. This datasheet also covers the MMP7072-127-1 variant, as both devices belong to the same high power melf pin diodes family and are provided as variant models within a single manufacturer datasheet.

General Description

The MMP7072-127-1, MMP7076-127-1, MMP7080-127-1 MELF PIN Diode Family is manufactured using Aeroflex/Metelics proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package.

Key Features

  • Higher Average Power Handling: >100 Watts CW.
  • Higher Voltage Rating: >600 Volts.
  • Lower Rs:.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MMP7072-127-1-Aeroflex.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MMP7076-127-1
Manufacturer Aeroflex
File Size 253.46 KB
Description High Power MELF PIN Diodes
Datasheet download datasheet MMP7076-127-1 Datasheet

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Other Datasheets by Aeroflex

Part Number Description
MMP7072-127-1 High Power MELF PIN Diodes
MMP7080-127-1 High Power MELF PIN Diodes
MMPN-080045-C50 MICROSTRIP PIN DIODES
MMPN-080150-C51 MICROSTRIP PIN DIODES
MMPN080045 PIN Diodes

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
High Power MELF PIN Diodes Series MMP7072-127-1, MMP7076-127-1, MMP7080-127-1 Datasheet Features • Higher Average Power Handling: >100 Watts CW • Higher Voltage Rating: >600 Volts • Lower Rs: <0.8 (Lower Insertion Loss & Higher IIP3) • Lower Thermal Resistance: <20 °C / W for Higher Power • Ceramic Surface Mount Package • RoHS Compliant • Hermetically Sealed Case Style 127-1 Description The MMP7072-127-1, MMP7076-127-1, MMP7080-127-1 MELF PIN Diode Family is manufactured using Aeroflex/Metelics proprietary diode process which optimizes the anode and cathode bonding area of the diode to the adjacent heat spreading metal posts within the ceramic package.