The TO-220CFM package is widely preferred for all commercialindustrial through hole applications. The mold compound pro.

S AP2763 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of.

AP2763I-A

AP2763W-A

AP2761I-A

AP2761I-A-HF

AP2761I-A-HF-3

AP2761I-H

AP2761I-H-HF

AP2761P-A

AP2761R-A

AP2761R-A-HF

AP2761S-A-HF

AP2762I-A

AP2762I-A-HF

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