The TO-220CFM package is widely preferred for all commercialindustrial through hole applications. The mold compound pro.

S AP25N170 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range .

AP25N10GH

AP25N10GH-HF

AP25N10GH-HF-3

AP25N10GJ

AP25N10GJ-HF

AP25N10GJ-HF-3

AP25N10GP-HF

AP25N10GS-HF

AP25N10J-HF

AP25N10P-HF

AP2501

AP2501A

AP2502

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