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FEATURES • InGaP HBT Technology • -50 dBc ACPR @ 65 MHz, +27 dBm • 29 dB Gain
• High Efficiency • Low Transistor Junction Temperature
• Matched for a 50 Ω System • Low Profile Miniature Surface Mount Package;
RoHS Compliant
• Multi-Carrier Capability
AWB7227
2.11-2.17 GHz
Small-Cell Power Amplifier Module
PRELIMINARY DATA SHEET - Rev 1.6
APPLICATIONS • WCDMA, HSDPA and LTE Air Interfaces
• Picocell, Femtocell, Home Nodes
• Customer Premises Equipment (CPE)
• Data Cards and Terminals
M52 Package 14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION The AWB7227 is a fully matched, Multi-Chip-Module (MCM) designed for picocell, femtocell, and customer premises equipment (CPE) applications.
AWB7227 Datasheet
