Preliminary PI3042A datasheet
400DPI CIS Sensor Chip
Engineering Data Sheet
Peripheral Imaging Corporation PI3042A CIS, Contact Image Sensor is a 400 dot per inch
(dpi) resolution, linear array image sensor chip. The sensor chip is processed using PIC’s
proprietary CMOS Image Sensor Technology. Designed for cascading multiple chips in a
series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a
printed circuit board (PCB). This bonding process allows users to produce variable CIS
module lengths in increments of chip array lengths. Hence, the wide variety of image reading
widths can easily be applied to the numerous document scanners, found in facsimile, as well
as, the narrow width scanners, such as, those found in check readers, lotto tickets, entrance
gate tickets and other office automation equipment which requires a wide variety of scanning
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector
elements, their associated multiplexing switches, buffers, and a chip selector. The detectors
element-to-element spacing is approximately 62.5 µm. The size of each chip without scribe lines is
8080 µm by 385 µm. Each sensor chip has 7 bonding pads. The pad symbols and functions are
described in Table 1.
1 2 3 4 Row of 128 Sensors 125 126 127 128
and Video Signal
Readout Shift Register
CP VDD DGND
Figure 1. PI3042A Block Diagram
Start Pulse: Input clock to start the line scan.
Clock Pulse: Input clock to clock of the Shift Register.
Positive Supply: +5 volt supply connected to substrate.
Digital Ground: Connection topside common
Signal Current Output: Output for video signal current
Analog Ground: Connection topside common
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
Page 2 of 18 Date: 09/23/05