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AMI SEMICONDUCTOR

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PI3039 Datasheet

600DPI CIS Image Sensor Chip

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Peripheral
Imaging
Corporation
PI3039
600DPI CIS Image Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3039 CIS (Contact Image Sensor) sensor chip is a linear
array image sensor chip with a 600 elements per inch resolution. The sensor chip is fabricated
with PIC’s proprietary CMOS Image Sensing Technology. Since this image sensor chip is
intended for CIS module applications, multiple numbers of these sensors will be serially
cascaded to form a linear scanning image array of arbitrary length. These sensors are butted
end-to-end on a printed circuit board (PCB). The sensors are mounted using the chip-on-
board technology to form scanning arrays with various lengths
8080 µm
1 2 3 4 ROW OF 192 SENSORS 189 190 191 192
AND VIDEO SIGNAL
LINE MULTIPLEXER
READ OUT SHIFT REGISTER
360 µm
BUFFER
SP
BUFFER
CP VDD
VSS
CHIP
SELECT
IOUT
BUFFER
EOS
Figure 1. PI3039 Sensor Block Diagram
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements,
their associated multiplexing switches, buffer amplifiers, and a chip selector. The detector's element-
to-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080 µm
by 360 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in
Table 1.
Page 1 of 10, PI3039, 12/2/02




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PI3039 Datasheet

600DPI CIS Image Sensor Chip

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SYMBOL
SP
CP
VDD
VSS
IOUT
EOS
FUNCTION
Start Pulse: Input to start the line scan.
Clock Pulse: Input to clock the Shift Register.
Positive Supply: +5 volt supply connected to substrate.
VSS is tied to ground: Connection topside common
Video Signal Current Output from a source follower.
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
Read Line
333 µm
SP
8080 µm
PI3039 IMAGE SENSOR, 192 PIXELS, 42 µm PITCH
CP VDD
VSS
IOUT
360 µm
EOS
YX
PAD
SP
CP
VDD
VSS
IOUT
EOS
X
FUNCTION
START INPUT
CLOCK INPUT
+5 SUPPLY
TIED TO GROUND
VIDEO SIGNAL OUT
SCAN OUTPUT
NOTE: ALL PAD OPENINGS ARE 140 X 80 µm
YX
30 575
30 2195
30 3295
30 4373
30 5495
30 7272
NOTES:
1. THE DRAWING IS NOT TO SCALE.
2. THE DIE LENGTH AND WIDTH ARE GIVEN AS SHOWN.
3. THE PAD LOCATION ARE GIVEN IN THE TABLE.
4. THERE ARE 2 EXAMPLES OF THE X & Y LOCATIONS
SHOWN ON THE FIRST 2 PADS.
5. ALL DIMENSIONS ARE IN µm.
Figure 2. Bonding Pad Layout Diagram:
Figure 2 shows the bonding pad locations for PI3039 Sensor Chip. The locations are referenced to the
lower left corner of the die.
Electro-Optical Characteristics (25o C)
Table 2, below, lists the electro-optical characteristics of PI3039 sensor chip at 25o C.
Parameters
Number of Photo-elements
Pixel-to-pixel spacing
Chip scanning rate
Symbols
Tint (1)
Clock frequency
fclk (2)
IOUT (Saturation charge
Qsat (3)
output for a given sample time)
At 5.0 MHz clock frequency.
Typical
192
42
38.4
5.0
170 to 200
Units
elements
µm
µsec
MHz
pC
Notes
@ typical 5 MHz pixel rate.
See note 2.
See note 2
With 570nm light source.
At saturation exposure of
5.7 Joules/cm2
PAGE 2 OF 10, PI3039, 12/2/02


Part Number PI3039
Description 600DPI CIS Image Sensor Chip
Maker AMI SEMICONDUCTOR
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