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PI3034A Datasheet

200DPI CIS Sensor Chip

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Peripheral
Imaging
Corporation
PI3034A
200DPI CIS Sensor Chip
Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3034A CIS sensor chip is a 200 dot per inch resolution
linear array image sensor chip, which uses PIC’s proprietary CMOS Image Sensing
Technology. This image sensor’s intended applications are to fabricate Contact Image Sensor,
CIS modules with various lengths. This is accomplished by mounting them on a printed circuit
board (PCB) through an end-to-end butting process. This process is generally referred to as
the chip-on-board technology. Its typical circuit implementation in an A4 size 1728 elements
CIS module is shown in a schematic diagram on page 6. The schematic demonstrates its
operational implementation and interfacing circuits. They are used in facsimile, scanner, check
reader, and office automation equipment.
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 64 detector elements,
their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element
spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 290 um.
Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.
7950 µm
1 2 3 4 Row of 64 Sensors 61 62 63 64
and Video Signal
Line Multiplexer
Read Out Shift Register
290
µm
Buffer
SI
Buffer
CLK VDD VSS
Chip
Select
SIG
Buffer
SO
Figure 1. PI3034A Sensor Chip Block Diagram
Page 1 of 7 - PI3034A, 06/15/03




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PI3034A Datasheet

200DPI CIS Sensor Chip

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SYMBOL
SI
CLK
VDD
VSS
SIG
SO
FUNCTION
Start Pulse: Input to start the line scan.
Clock Pulse: Input to clock the Shift Register.
Positive Supply: +5 volt supply connected to substrate.
Digital Ground: Connection topside common.
Signal Current Output: Output for video signal current
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
Bonding pad layout diagram:
Figure 2 shows the bonding pad locations for PI3034A Sensor Chip relative to the lower left corner
of the die.
7950 µm
Y SI
SENSOR DIE
CLK VDD GRD SIG
290 µm
SO
X
X
NOTE: ALL PAD OPENINGS ARE 140 X 80 µm.
PAD
SI
CLK
VDD
VSS
SIG
SO
FUNCTION
START INPUT
CLOCK INPUT
+5 SUPPLY
GROUND
VIDEO SIGNAL OUT
SCAN OUTPUT
Y
67.5
67.5
67.5
67.5
67.5
67.5
X
737.0
1546.5
2356.0
3156.5
3975.0
7213.0
NOTES:
1. THE DRAWING IS NOT TO SCALE.
2. THE DIE LENGTH AND WIDTH
ARE GIVEN AS SHOWN.
3. THE PAD LOCATION ARE GIVEN
IN THE TABLE.
4. THERE ARE TWO EXAMPLES
OF THE X AND Y LOCATIONS
SHOWN ON THE FIRST TWO PADS.
THEY ARE MEASURED TO THE LEFT
BOTTOM CORNER OF THE PAD OPENING.
5. ALL DIMENSIONS ARE IN µm.
PI3034A IMAGE SENSOR
Figure 2. Bonding Pad Layout Diagram
Electro-Optical Characteristics (25 °C)
Table 2, below, lists the electro-optical characteristics of PI3034A sensor chip at 25 °C.
Parameters
Number of Photo-elements
Pixel-to-pixel spacing
Line scanning rate
Clock frequency
Video Output Voltage
Amplitude
Output voltage non-uniformity
Symbols
Tint (1)
f (2)
Vp (3)
Up (4)
Typical
64
125
3.45
0.5
1.0
± 7.5
Units
elements
µm
ms/line
MHz
Volts
%
Notes
Vp depends the output
circuits. See note 3.
Page 2 of 7 - PI3034A, 06/15/03


Part Number PI3034A
Description 200DPI CIS Sensor Chip
Maker AMI SEMICONDUCTOR
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