| Part Number | WED3C755E8M-XBX |
| Manufacturer | White Electronic Designs Corporation |
| Title | RISC MICROPROCESSOR MULTI-CHIP PACKAGE |
| Description | www..com White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW The WEDC 755E/SSRAM multichip pack... |
| Features |
doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 ...
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| Datasheet |
 WED3C755E8M-XBX Datasheet
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