| Part Number | FBGA-SD |
| Manufacturer | STATS ChipPAC |
| Title | Fine Pitch Ball Grid Array |
| Description | STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages. Tape versio... |
| Features |
• 2 die to 7 die stack with spacer capability • 5 x 5mm to 23 x 23mm body size • Package height at 1.0, 1.2, 1.4 and 1.7mm max. • Flexible die stacking options (“pyramid,” “same die,” etc.) • 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder b... |
| Datasheet |
 FBGA-SD Datasheet
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