| Part Number | AN241 |
| Manufacturer | Philips |
| Title | Thermal Considerations |
| Description | Philips Semiconductors Advanced BiCMOS Products Application note Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBY... |
| Features |
uch smaller, but the thermal energy is concentrated more densely on the printed wiring board. For these reasons, designers and manufacturers of surface mount assemblies must be aware of all the variables affecting TJ.
There are five major factors co...
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| Datasheet |
 AN241 Datasheet
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