| Part Number | SL2ICS2001V1D |
| Manufacturer | NXP (https://www.nxp.com/) |
| Title | I-CODE SLI Label IC bumped wafer specification on UV-tape |
| Description | This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ... |
| Features |
size) caused neither a long term influence on the behaviour of the ICs nor on the data retention of the EEPROMs.
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9. References
• • • • • • Data sheet “I-CODE SLI Label IC, functional specification” Data sheet “General specificati... |
| Datasheet |
 SL2ICS2001V1D Datasheet
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